Samsung and TSMC hope AMSL's new machines will help address the chip shortage
Engadget | 08.09.2026 17:58
Samsung and TSMC will join Intel in adopting ASML's latest High NA extreme ultraviolet (EUV) lithography chip fab machines, ASML announced. The three companies also unveiled a new initiative to adopt larger 12-inch photomasks that will hopefully boost manufacturing yields and lower chipmaking costs. Samsung and TSMC will deploy ASML's NA EUV tech by 2028 and 2030 respectively, while 12-inch photomasks are expected to arrive in advanced node production by 2033.
